Kingbo BGA Reballing Solder Flux Paste
$8.15
– Weight: 100 g / bottle
– Excellent capacity of solder-stickiness
– Excellent Anti-wet Capacity
– Widely used on BGA, PGA, CSP packages and Flip Chip Operation
– Suitable for multiple PCB Reflow
– No-clean and Lead free for Environmental protection
10000 in stock
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Description
– Sort: Lead-free and No-clean
– Shelf life: 1 year
– Storage: Keep refrigerated
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