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HomeProductsElectronics / ComputerKingbo BGA Reballing Solder Flux Paste

Kingbo BGA Reballing Solder Flux Paste


– Weight: 100 g / bottle

– Excellent capacity of solder-stickiness

– Excellent Anti-wet Capacity

– Widely used on BGA, PGA, CSP packages and Flip Chip Operation

– Suitable for multiple PCB Reflow

– No-clean and Lead free for Environmental protection

10000 in stock

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SKU: p050 Categories: ,


– Sort: Lead-free and No-clean

– Shelf life: 1 year

– Storage: Keep refrigerated


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